Figuring out a way to make semiconductors make themselves would certainly save everyone a lot of time and money, and IBM next week says it will discuss a technique that moves it closer to the goal of self-assembly.
On May 3, researchers will provide some details on what IBM says is a commercially practical technique for applying an insulating layer through chips using self-assembly. Now, adding layers and structures to a chip requires costly and time consuming processes: intricate patterns are etched onto microscopic surfaces, spr…
Source: News.com